Hello, World!

My name is Chenghan (Kevin) Wang (b.1998, Jinan, Shandong, PRC), also known as 王成晗. I am a PhD student at the Department of Computer Science and Engineering (CSE), the Chinese University of Hong Kong (CUHK), under the supervision of Prof. Tsung-Yi Ho. My research interest is Electronic Design Automation (EDA) of advanced packaging, especially multiphysics simulation, numerical computing and HPC.

Education Experience

• PhD, Department of Computer Science and Engineering (CSE), the Chinese University of Hong Kong (CUHK), Aug. 2025 - Present, supervised by Prof. Tsung-Yi Ho.
• M.Eng, EDA Center, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), Sep. 2021 - Jun. 2024, supervised by Prof. Qinzhi Xu
• B.Eng, School of Information Science and Engineering, Harbin Institute of Technology at Weihai (HITWH), Sep. 2017 - Jun. 2021.

Work Experience

• Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS)
  • Role: Assistant Engineer
  • Period: Jul. 2024 - Jun. 2025

Academic Publications

Conference Papers:

• [C3] Z. Wang, T. Hou, C. Wang, Z. Zhuang, T.-Y. Ho, F. Farnia, B. Yu, “FastRW: An Efficient Random Walk Method for Steady-State Thermal Analysis,” DATE, Apr 2026. here
• [C2] C. Wang, Z. Zhuang, K. Zhu, D. Huang, L. Costero, R. Chen, D. Atienza, T.-Y. Ho, “ETLA-3D: Equivalent Thin Layer Aggregation based Thermal FEM for Hybrid Bonding F2F 3D ICs,” DATE, Apr 2026. Click here
• [C1] X. Ma, Q. Xu, Z. Sun, C. Wang, H. He, K. An, J. Liu, H. Cao, D. Zhang, T. Sun, Z. Li, “An Analytical Electrical-Thermal Coupling Model for TSV with Non-Uniform Substrate Temperature,” ISEDA, May 2025. Click here

Journal Papers:

• [J7] K. An, Q. Xu, H. He, X. Ma, C. Wang, H. Cao, J. Liu, D. Zhang, T. Sun, Z. Li, “Transient Thermal Model of Advanced Nanotransistors: A Case Study of CFET,” IEEE TED, 2025. Click here
• [J6] H. Cao, Q. Xu, J. Liu, Z. Li, C. Wang, X. Ma, K. An, D. Zhang, T. Sun, “Two-Dimensional Thermal-Induced Warpage Prediction for Multi-Chiplet Heterogeneous Integration System in Advanced Packaging,” IEEE TCPMT, 2025. Click here
• [J5] Q. Xu, C. Wang, Z. Li, D. Zhang, X. Ma, H. Cao, J. Liu, “A Wafer-Scale Heterogeneous Integration Thermal Simulator,” Applied Thermal Engineering, 2025. Click here
• [J4] X. Ma, Q. Xu, C. Wang, H. Cao, J. Liu, D. Zhang, Z. Li, “An Electrical-Thermal Co-Simulation Model of Chiplet Heterogeneous Integration Systems,” IEEE TVLSI, 2024. Click here
• [J3] C. Wang, Q. Xu, C. Nie, H. Cao, J. Liu, D. Zhang, Z. Li, “A Multiscale Anisotropic Thermal Model of Chiplet Heterogeneous Integration System,” IEEE TVLSI, 2024. Click here
• [J2] C. Wang, Q. Xu, C. Nie, H. Cao, J. Liu, Z. Li, “An efficient thermal model of chiplet heterogeneous integration system for steady-state temperature prediction,” Microelectronics Reliability, 2023. Click here
• [J1] C. Nie, Q. Xu, C. Wang, H. Cao, J. Liu, Z. Li, “Efficient transient thermal analysis of chiplet heterogeneous integration,” Applied Thermal Engineering, 2023. Click here

Teaching Assistant

• Single Variable Calculus for Engineers, ENGG1225G, Spring 2026.
• Discrete Mathematics for Engineers, ENGG2440A, Fall 2025.

Skills

• Mathematics: Linear Algebra, Numerical Analysis, Differential Equations, Linear Systems.
• Tools: FEM simulators, PyTorch, CUDA matrix solvers.
• Languages: Mandarin Chinese, English.