About Chenghan

Hello, World!

My name is Chenghan (Kevin) Wang (b.1998, Jinan, Shandong, PRC), also known as 王成晗. I am a PhD student at the Department of Computer Science and Engineering (CSE), the Chinese University of Hong Kong (CUHK), under the supervision of Prof. Tsung-yi Ho. My research interest is Electronic Design Automation (EDA) of heterogeneous integration 2.5D/3D ICs, especially multiphysics simulation and numerical computing.

Education Experience

PhD, Department of Computer Science and Engineering (CSE), the Chinese University of Hong Kong (CUHK), Aug. 2025 - , supervised by Prof. Tsung-yi Ho
M.Eng, EDA Center, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), Sep. 2021 - Jun. 2024, supervised by Prof. Qinzhi Xu
B.Eng, School of Information Science and Engineering, Harbin Institute of Technology at Weihai (HITWH), Sep. 2017 - Jun. 2021.

Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS)
- Role: Assistant Engineer
- Period: Jul. 2024 - Jun. 2025

Journal Papers:

[J7] K. An, Q. Xu*, H. He, X. Ma, C. Wang, H. Cao, J. Liu, D. Zhang, T. Sun, Z. Li, “Transient Thermal Model of Advanced Nanotransistors: A Case Study of CFET,” IEEE TED, Jun 2025. Click here
[J6] H. Cao*, Q. Xu*, J. Liu, Z. Li, C. Wang, X. Ma, K. An, D. Zhang, T. Sun, “Two-Dimensional Thermal-Induced Warpage Prediction for Multi-Chiplet Heterogeneous Integration System in Advanced Packaging,” IEEE TCPMT, Apr 2025. Click here
[J5] Q. Xu*, C. Wang(the First Student Author), Z. Li*, D. Zhang, X. Ma, H. Cao, J. Liu, “A Wafer-Scale Heterogeneous Integration Thermal Simulator,” Applied Thermal Engineering, Apr 2025. Click here
[J4] X. Ma, Q. Xu*, C. Wang, H. Cao, J. Liu, D. Zhang, Z. Li*, “An Electrical-Thermal Co-Simulation Model of Chiplet Heterogeneous Integration Systems,” IEEE TVLSI, Oct 2024. Click here
[J3] C. Wang, Q. Xu*, C. Nie, H. Cao, J. Liu, D. Zhang, Z. Li, “A Multiscale Anisotropic Thermal Model of Chiplet Heterogeneous Integration System,” IEEE TVLSI, Jan 2024. Click here
[J2] C. Wang, Q. Xu*, C. Nie, H. Cao, J. Liu, Z. Li, “An efficient thermal model of chiplet heterogeneous integration system for steady-state temperature prediction,” Microelectronics Reliability, Jul 2023. Click here
[J1] C. Nie, Q. Xu*, C. Wang, H. Cao, J. Liu, Z. Li, “Efficient transient thermal analysis of chiplet heterogeneous integration,” Applied Thermal Engineering, Jul 2023. Click here

Conference Papers:

[C1] X. Ma, Q. Xu*, Z. Sun, C. Wang, H. He, K. An, J. Liu, H. Cao, D. Zhang, T. Sun, Z. Li, “An Analytical Electrical-Thermal Coupling Model for TSV with Non-Uniform Substrate Temperature,” ISEDA, May 2025.